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Shenzhen Semshine Technology Co. Ltd
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High-density multilayer PCBs
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Aluminum base PCBs
[56]
Double access flexible PCBs
[1]
Double-sided flexible PCBs
[3]
Double-sided PCBs
[67]
Flexible PCBs
[25]
High-density multilayer PCBs
[7]
Multilayer PCBs
[40]
PCB assemblies
[39]
PCB laminates
[11]
Rigid LED strips
[6]
Rigid-flex PCBs
[14]
Single-sided PCBs
[31]
Shenzhen Semshine Technology Co. Ltd
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Multi-layer PCB, 1.0mm thickness, suitable for communication equipment
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Quick Turn PCB Prototypes
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Solderless Breadboard Kit
Solderless Breadboard Kit 3.3V 5V Plug-In Breadboard Power Supply
CIXI ZHONGYI ELECTRONIC EQUIPMENT FACTORY
Shenzhen Semshine Technology Co. Ltd
City:
Shenzhen
Province/State:
Guangdong
Country/Region:
China
Tel:
(86 755) 82544386
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Multi-layer PCB, 1.0mm thickness, suitable for communication equipment
Multi-layer PCB, 1.0mm thickness, suitable for communication equipment
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Green Solder Mask High-density Multilayer PCB with 1.2mm board thickness
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High-density Multilayer PCB, used to communication facilities
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0.15mm Blind and Buried via Multilayer PCB, used to communication facilities, made of FR4
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HDI PCB Board with ENIG Surface Finished, 6 Layers
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High-density Multilayer PCB with 1.575 ± 0.1575mm Finish Thickness, Small Orders are Accepted
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PCB with Immersion Gold Surface Finish and FR4 Base, Measures 116 x 37mm
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